About Me
Experience Second To None in Chip Manufacturing
1.Patrick gained a unique advantage working for TI (IDM), PDF (Yield) and AMAT (Equip);
getting Final Test, Process and Equipment Data for building a science-knowledgebase of cause-effect of problems in High Volume Manufacturing and Technology Development proven in31 fabs
Competitors do not have this
By nature of their business, they are specialized
- Equipment vendors, (AMAT, LAM, TEL…) get only tool data.
- Yet wafers processed correctly on their tools result in poor yield and output
- Yield companies (PDF) get electrical data but do not know tools. Yet 83% of all fab failures are from tools. They can only point to problems, not fix them.
What My Customers Says
1.“Tom Weichel : Patrick, I like this. Have you been sending this format all along? I like to see a dashboard of metrics in a table and summary format. This helps me focus quickly on key issues. regards, tom “
2.Venu Menon Patrick, I know you went through C035.C with a fine tooth comb. Can you send me & Ben an executive summary of your findings and recommendations? Thanks and regards. Venu
3. Stan Ashburn RE:Hello world from Gemini): Patrick, and Readiness Team, a large part of this success is due to you and the Readiness team’s coordination
4 .Howard Tigelaar In my view what was done differently on C035.B that enabled the success was new methodologies introduced by Patrick and me and outstanding execution by mainly Kevin Logue’s and Art Flores’ teams…. – rgds, Howard
5.Julie England : Awesome job on yield readiness with respect to DD; no debate. So, overall, I have to tell you one of the reasons we received this award is C035.B yield ahead of plan. And for that, you can be very proud. Thanks & regards, Julie
